Description
The Lenovo ThinkSystem 256GB TruDDR5 4800MHz 3DS RDIMM-A is a high-capacity server memory module built on 3DS (3-Dimensional Stacked) technology for AMD processor-based ThinkSystem V3 servers. Using TSV (Through Silicon Via) stacking, it enables higher-density memory configurations while maintaining performance and helping lower total cost of ownership.
Key Features
- 256GB capacity
- TruDDR5 memory technology
- 4800 MHz memory speed
- 3DS (3-Dimensional Stacked) RDIMM design with TSV technology
- 8Rx4 rank/width configuration
- Designed for AMD processor-based ThinkSystem servers
- Higher density DRAM stacking with reduced power consumption
- Compatible with ThinkSystem SR635 V3, SR655 V3, SR645 V3, and SR665 V3 servers
Technical Specifications
| Specification | Details |
|---|---|
| Brand | Lenovo |
| Manufacturer Part Number | 4X77A81444 |
| Feature Code | BQ3B |
| Product Type | Server Memory (3DS RDIMM) |
| Memory Technology | TruDDR5 |
| Capacity | 256GB |
| Speed | 4800 MHz |
| Rank / Width Configuration | 8Rx4 |
| Processor Compatibility | AMD |
| Compatible Servers | ThinkSystem SR635 V3, SR655 V3, SR645 V3, SR665 V3 |
Payment & Security
Your payment information is processed securely, and we do not store credit card details or access your credit card information.
Return Policy (Short Summary)
We offer a 30-day return window for most unopened, factory-sealed items.
Returns must be authorized before shipping back and must include all original packaging and accessories. Opened or used items are not returnable unless defective.
Some productsβsuch as custom orders, special-order items, audio gear, software, and LED video wallsβare non-returnable. Non-defective returns may be subject to a 20β30% restocking fee, and customers are responsible for return shipping costs.
For damaged or incorrect items, please contact us immediately.
From Scope to Sign-Off
A structured delivery process designed to reduce risk and keep projects moving.
Plan
Discovery, site review, requirements gathering, and project alignment. We define scope, constraints, and success criteria before any design work begins.
- Discovery calls & stakeholder interviews
- On-site survey & infrastructure review
- Requirements & use-case documentation
- Project scope, timeline & milestone alignment
Engineer
System design, schematics, signal flow, BOM development, and documentation. Every project leaves this phase with a complete engineering package.
- AV system design & signal flow diagrams
- Equipment selection & BOM development
- Rack layout & control system design
- As-built documentation package
Deploy
Procurement, logistics, installation, programming, commissioning, and training. We own the delivery from first shipment to final handoff.
- Authorized procurement & logistics coordination
- Physical installation & cable management
- Control system programming & configuration
- Commissioning, testing & end-user training
Support
Monitoring, maintenance, lifecycle planning, and long-term service agreements. We stay engaged long after project close.
- 24/7 remote system monitoring
- Preventive & reactive maintenance
- Technology lifecycle & refresh planning
- Long-term service level agreements
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