Description
The AMD Ryzen™ 5 7500F is a high-performance desktop processor built on the Zen 4 architecture, delivering responsive performance for gaming, productivity, and demanding desktop applications. Featuring 6 CPU cores and 12 threads, the Ryzen 5 7500F operates at a 3.7 GHz base clock and can boost up to 5.0 GHz with AMD Precision Boost 2 technology.
Designed for the AM5 platform, the processor supports DDR5 memory and PCIe 5.0, providing a modern foundation for high-speed storage, graphics, and system expansion. It includes 32 MB of L3 cache, supports up to 128 GB of DDR5 memory, and features AMD EXPO™ Technology for optimized memory overclocking.
With an efficient 65W TDP, unlocked overclocking support, Precision Boost Overdrive, Curve Optimizer, and AMD Ryzen™ Master compatibility, the Ryzen 5 7500F offers flexibility for enthusiasts looking to tune system performance. An AMD Wraith Stealth cooler is included for a complete processor and cooling solution.
The Ryzen 5 7500F requires a discrete graphics card, making it ideal for desktop systems built around dedicated GPU performance.
Technical Specifications
| Specification | Details |
|---|---|
| Brand | AMD |
| Processor Name | AMD Ryzen™ 5 7500F |
| Family | Ryzen |
| Series | Ryzen 7000 Series |
| Form Factor | Desktop, Boxed Processor |
| Market Segment | Enthusiast Desktop |
| Former Codename | Raphael AM5 |
| Processor Architecture | Zen 4 |
| CPU Cores | 6 |
| Threads | 12 |
| Multithreading (SMT) | Yes |
| Base Clock | 3.7 GHz |
| Max Boost Clock | Up to 5.0 GHz |
| L1 Cache | 384 KB |
| L2 Cache | 6 MB |
| L3 Cache | 32 MB |
| Default TDP | 65W |
| CPU Core Process Technology | TSMC 5nm FinFET |
| I/O Die Process Technology | TSMC 6nm FinFET |
| CPU Compute Die (CCD) Size | 71 mm² |
| I/O Die (IOD) Size | 122 mm² |
| Package Die Count | 2 |
| Unlocked for Overclocking | Yes |
| AMD EXPO™ Technology | Yes |
| Precision Boost Overdrive | Yes |
| Curve Optimizer Voltage Offsets | Yes |
| AMD Ryzen™ Master Support | Yes |
| CPU Socket | AM5 |
| Supporting Chipsets | A620, X670E, X670, B650E, B650, X870E, X870, B840, B850 |
| CPU Boost Technology | Precision Boost 2 |
| Instruction Set | x86-64 |
| Supported Extensions | AES, AMD-V, AVX, AVX2, AVX512, FMA3, MMX-plus, SHA, SSE, SSE2, SSE3, SSE4.1, SSE4.2, SSE4A, SSSE3, x86-64 |
| Included Thermal Solution | AMD Wraith Stealth |
| Max. Operating Temperature (Tjmax) | 95°C |
| Operating System Support | Windows 11 64-Bit, Windows 10 64-Bit, RHEL x86 64-Bit, Ubuntu x86 64-Bit |
Connectivity & Memory
| Specification | Details |
|---|---|
| Native USB 3.2 Gen 2 (10Gbps) | 4 |
| Native USB 3.2 Gen 1 (5Gbps) | 0 |
| Native USB 2.0 (480Mbps) | 1 |
| Native SATA Ports | 0 |
| PCI Express Version | PCIe® 5.0 |
| Native PCIe Lanes | 28 Total / 24 Usable |
| X670E Additional PCIe Lanes | 12x Gen4 |
| X670 Additional PCIe Lanes | 12x Gen4 |
| B650E Additional PCIe Lanes | 8x Gen4 |
| B650 Additional PCIe Lanes | 8x Gen4 |
| A620 Additional PCIe Lanes | 4x Gen3 |
| NVMe Support | Boot, RAID 0, RAID 1, RAID 10 |
| System Memory Type | DDR5 |
| Memory Channels | 2 |
| Maximum Memory | 128 GB |
| Memory Subtype | UDIMM |
| Maximum Memory Speed – 2x1R | DDR5-5200 |
| Maximum Memory Speed – 2x2R | DDR5-5200 |
| Maximum Memory Speed – 4x1R | DDR5-3600 |
| Maximum Memory Speed – 4x2R | DDR5-3600 |
| ECC Support | Yes, requires motherboard support |
Graphics & Technologies
| Specification | Details |
|---|---|
| Graphics Model | Discrete Graphics Card Required |
| Supported Technologies | AMD EXPO™ Technology, AMD Ryzen™ Technologies |
Payment & Security
Your payment information is processed securely, and we do not store credit card details or access your credit card information.
Return Policy (Short Summary)
We offer a 30-day return window for most unopened, factory-sealed items.
Returns must be authorized before shipping back and must include all original packaging and accessories. Opened or used items are not returnable unless defective.
Some products—such as custom orders, special-order items, audio gear, software, and LED video walls—are non-returnable. Non-defective returns may be subject to a 20–30% restocking fee, and customers are responsible for return shipping costs.
For damaged or incorrect items, please contact us immediately.
From Scope to Sign-Off
A structured delivery process designed to reduce risk and keep projects moving.
Plan
Discovery, site review, requirements gathering, and project alignment. We define scope, constraints, and success criteria before any design work begins.
- Discovery calls & stakeholder interviews
- On-site survey & infrastructure review
- Requirements & use-case documentation
- Project scope, timeline & milestone alignment
Engineer
System design, schematics, signal flow, BOM development, and documentation. Every project leaves this phase with a complete engineering package.
- AV system design & signal flow diagrams
- Equipment selection & BOM development
- Rack layout & control system design
- As-built documentation package
Deploy
Procurement, logistics, installation, programming, commissioning, and training. We own the delivery from first shipment to final handoff.
- Authorized procurement & logistics coordination
- Physical installation & cable management
- Control system programming & configuration
- Commissioning, testing & end-user training
Support
Monitoring, maintenance, lifecycle planning, and long-term service agreements. We stay engaged long after project close.
- 24/7 remote system monitoring
- Preventive & reactive maintenance
- Technology lifecycle & refresh planning
- Long-term service level agreements
A decade of delivery — trusted by 275+ clients across industries
