Description
The AMD Ryzen Threadripper 7970X is a high-performance 32-core, 64-thread desktop processor designed for demanding workstation-class workloads, intensive multitasking, content creation, rendering, development, and enthusiast computing. Built on AMD’s Zen 4 architecture and advanced 5nm process technology, it delivers a 4.0 GHz base clock with boost speeds of up to 5.3 GHz.
With 32MB of L2 cache and 128MB of L3 cache, the Threadripper 7970X provides fast access to frequently used data and strong performance across complex, highly threaded applications. The processor supports the sTR5 socket and TRX50 chipset, along with PCIe 5.0 connectivity and quad-channel DDR5 RDIMM memory.
The Ryzen Threadripper 7970X is unlocked for overclocking and supports AMD EXPO Technology, Precision Boost 2, Precision Boost Overdrive, and Curve Optimizer. ECC memory support and a broad suite of AMD security and virtualization technologies make it suitable for powerful professional and enthusiast desktop systems.
A discrete graphics card and compatible thermal solution are required.
Technical Specifications
| Specification | Details |
|---|---|
| Manufacturer Part Number | 100-100001351WOF |
| Brand | AMD |
| Product Name | AMD Ryzen Threadripper 7970X |
| Processor Family | Ryzen Threadripper |
| Series | Ryzen Threadripper 7000 Series |
| Form Factor | Desktop |
| Market Segment | Enthusiast Desktop |
| Former Codename | Storm Peak |
| Processor Architecture | Zen 4 |
| CPU Cores | 32 |
| Threads | 64 |
| Multithreading (SMT) | Yes |
| Base Clock | 4.0 GHz |
| Max Boost Clock | Up to 5.3 GHz |
| L1 Cache | 2048 KB |
| L2 Cache | 32 MB |
| L3 Cache | 128 MB |
| Default TDP | 350W |
| CPU Core Process Technology | TSMC 5nm FinFET |
| I/O Die Process Technology | TSMC 6nm FinFET |
| CPU Compute Die (CCD) Size | 71 mm² |
| I/O Die (IOD) Size | 388 mm² |
| Package Die Count | 5 |
| CPU Socket | sTR5 |
| Supporting Chipset | TRX50 |
| Unlocked for Overclocking | Yes |
| AMD EXPO Memory Overclocking | Yes |
| Precision Boost Overdrive | Yes |
| Curve Optimizer Voltage Offsets | Yes |
| CPU Boost Technology | Precision Boost 2 |
| Instruction Set | x86-64 |
| Supported Extensions | AES, AMD-V, AVX, AVX2, AVX512, FMA3, MMX-plus, SHA, SSE, SSE2, SSE3, SSE4.1, SSE4.2, SSE4A, SSSE3, x86-64 |
| Thermal Solution | Not Included |
| Maximum Operating Temperature (Tjmax) | 95°C |
| OS Support | Windows 11 64-Bit, RHEL x86 64-Bit, Ubuntu x86 64-Bit |
| Native USB 3.2 Gen 2 (10Gbps) | 4 |
| Native SATA Ports | 2 |
| PCI Express Version | PCIe 5.0 |
| Native PCIe Lanes | 92 Total / 88 Usable |
| NVMe Support | Boot, RAID 0, RAID 1, RAID 10, RAID 5 |
| System Memory Type | DDR5 |
| Memory Subtype | RDIMM |
| Memory Channels | 4 |
| Memory Speed | Up to 5200 MT/s |
| ECC Support | Yes, Default Enabled |
| Integrated Graphics | No |
| Graphics Requirement | Discrete Graphics Card Required |
| DASH Support | Yes |
| AMD Memory Guard | Yes |
| AMD Secure Processor | Yes |
| Windows Secure Boot | Yes |
| UEFI Secure Boot | Yes |
| Windows Device Guard | Yes |
| Guest Mode Execution Trap (GMET) | Yes |
| Virtualization-Based Security (VBS) | Yes |
| Windows Secured-Core PC | Yes |
| Firmware TPM | Yes |
| AMD-V (SVM) | Yes |
| AMD-V Nested Paging (RVI) | Yes |
| AMD AVIC | Yes |
| AMD-Vi I/O MMU Virtualization | Yes |
| Second Level Address Translation (SLAT) | Yes |
| AES-NI | Yes |
| AMD Enhanced Virus Protection (NX Bit) | Yes |
| FIPS Certification | In Review |
| Supported Technologies | AMD EXPO Technology, AMD Ryzen Technologies |
Payment & Security
Your payment information is processed securely, and we do not store credit card details or access your credit card information.
Return Policy (Short Summary)
We offer a 30-day return window for most unopened, factory-sealed items.
Returns must be authorized before shipping back and must include all original packaging and accessories. Opened or used items are not returnable unless defective.
Some products—such as custom orders, special-order items, audio gear, software, and LED video walls—are non-returnable. Non-defective returns may be subject to a 20–30% restocking fee, and customers are responsible for return shipping costs.
For damaged or incorrect items, please contact us immediately.
From Scope to Sign-Off
A structured delivery process designed to reduce risk and keep projects moving.
Plan
Discovery, site review, requirements gathering, and project alignment. We define scope, constraints, and success criteria before any design work begins.
- Discovery calls & stakeholder interviews
- On-site survey & infrastructure review
- Requirements & use-case documentation
- Project scope, timeline & milestone alignment
Engineer
System design, schematics, signal flow, BOM development, and documentation. Every project leaves this phase with a complete engineering package.
- AV system design & signal flow diagrams
- Equipment selection & BOM development
- Rack layout & control system design
- As-built documentation package
Deploy
Procurement, logistics, installation, programming, commissioning, and training. We own the delivery from first shipment to final handoff.
- Authorized procurement & logistics coordination
- Physical installation & cable management
- Control system programming & configuration
- Commissioning, testing & end-user training
Support
Monitoring, maintenance, lifecycle planning, and long-term service agreements. We stay engaged long after project close.
- 24/7 remote system monitoring
- Preventive & reactive maintenance
- Technology lifecycle & refresh planning
- Long-term service level agreements
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