Description
The AMD Ryzen Threadripper 7960X is a high-performance desktop processor designed for demanding professional workloads, content creation, rendering, simulation, software development, and enthusiast computing. Powered by the Zen 4 architecture, this processor delivers 24 cores and 48 threads, a 4.2 GHz base clock, and boost frequencies of up to 5.3 GHz.
Built for the sTR5 platform and compatible with TRX50 chipsets, the Ryzen Threadripper 7960X supports DDR5 RDIMM memory with ECC, four memory channels, and high-bandwidth PCIe 5.0 connectivity with up to 88 usable PCIe lanes. Its substantial 128 MB L3 cache and 350W TDP provide the resources required for compute-intensive workstation and enthusiast applications.
The processor also supports advanced AMD technologies including Precision Boost 2, Precision Boost Overdrive, AMD EXPO Technology, and Curve Optimizer. Comprehensive virtualization and security capabilities include AMD Secure Processor, firmware TPM, AMD-V, AMD-Vi, Secure Boot, and AES-NI.
A discrete graphics card and compatible thermal solution are required.
Technical Specifications
| Specification | Details |
|---|---|
| Brand | AMD |
| Processor Name | AMD Ryzen Threadripper 7960X |
| Family | Ryzen Threadripper |
| Series | Ryzen Threadripper 7000 Series |
| Form Factor | Desktop |
| Market Segment | Enthusiast Desktop |
| Processor Architecture | Zen 4 |
| Former Codename | Storm Peak |
| CPU Cores | 24 |
| Threads | 48 |
| Multithreading (SMT) | Yes |
| Base Clock | 4.2 GHz |
| Max Boost Clock | Up to 5.3 GHz |
| L1 Cache | 1536 KB |
| L2 Cache | 24 MB |
| L3 Cache | 128 MB |
| Default TDP | 350W |
| CPU Core Process Technology | TSMC 5nm FinFET |
| I/O Die Process Technology | TSMC 6nm FinFET |
| CPU Compute Die (CCD) Size | 71 mm² |
| I/O Die (IOD) Size | 388 mm² |
| Package Die Count | 5 |
| CPU Socket | sTR5 |
| Supporting Chipset | TRX50 |
| Unlocked for Overclocking | Yes |
| CPU Boost Technology | Precision Boost 2 |
| Precision Boost Overdrive | Yes |
| Curve Optimizer Voltage Offsets | Yes |
| AMD EXPO Memory Overclocking Technology | Yes |
| Instruction Set | x86-64 |
| Supported Extensions | AES, AMD-V, AVX, AVX2, AVX512, FMA3, MMX-plus, SHA, SSE, SSE2, SSE3, SSE4.1, SSE4.2, SSE4A, SSSE3, x86-64 |
| Thermal Solution | Not Included |
| Maximum Operating Temperature (Tjmax) | 95°C |
| Operating System Support | Windows 11 64-Bit, RHEL x86 64-Bit, Ubuntu x86 64-Bit |
| PCI Express Version | PCIe 5.0 |
| Native PCIe Lanes | 92 Total / 88 Usable |
| Native USB 3.2 Gen 2 (10Gbps) | 4 |
| Native SATA Ports | 2 |
| NVMe Support | Boot, RAID 0, RAID 1, RAID 10, RAID 5 |
| System Memory Type | DDR5 |
| Memory Subtype | RDIMM |
| Memory Channels | 4 |
| Memory Speed | Up to 5200 MT/s |
| ECC Support | Yes, Default Enabled |
| Integrated Graphics | No |
| Graphics Requirement | Discrete Graphics Card Required |
| DASH Support | Yes |
| AMD Memory Guard | Yes |
| AMD Secure Processor | Yes |
| Windows Secure Boot | Yes |
| UEFI Secure Boot | Yes |
| Windows Device Guard | Yes |
| Virtualization-Based Security (VBS) | Yes |
| Windows Secured-Core PC | Yes |
| Firmware TPM | Yes |
| AMD-V (SVM) | Yes |
| AMD-V Nested Paging (RVI) | Yes |
| AMD AVIC | Yes |
| AMD-Vi / I/O MMU Virtualization | Yes |
| Second Level Address Translation (SLAT) | Yes |
| AES-NI | Yes |
| AMD Enhanced Virus Protection (NX Bit) | Yes |
| Supported Technologies | AMD EXPO Technology, AMD Ryzen Technologies |
Payment & Security
Your payment information is processed securely, and we do not store credit card details or access your credit card information.
Return Policy (Short Summary)
We offer a 30-day return window for most unopened, factory-sealed items.
Returns must be authorized before shipping back and must include all original packaging and accessories. Opened or used items are not returnable unless defective.
Some products—such as custom orders, special-order items, audio gear, software, and LED video walls—are non-returnable. Non-defective returns may be subject to a 20–30% restocking fee, and customers are responsible for return shipping costs.
For damaged or incorrect items, please contact us immediately.
From Scope to Sign-Off
A structured delivery process designed to reduce risk and keep projects moving.
Plan
Discovery, site review, requirements gathering, and project alignment. We define scope, constraints, and success criteria before any design work begins.
- Discovery calls & stakeholder interviews
- On-site survey & infrastructure review
- Requirements & use-case documentation
- Project scope, timeline & milestone alignment
Engineer
System design, schematics, signal flow, BOM development, and documentation. Every project leaves this phase with a complete engineering package.
- AV system design & signal flow diagrams
- Equipment selection & BOM development
- Rack layout & control system design
- As-built documentation package
Deploy
Procurement, logistics, installation, programming, commissioning, and training. We own the delivery from first shipment to final handoff.
- Authorized procurement & logistics coordination
- Physical installation & cable management
- Control system programming & configuration
- Commissioning, testing & end-user training
Support
Monitoring, maintenance, lifecycle planning, and long-term service agreements. We stay engaged long after project close.
- 24/7 remote system monitoring
- Preventive & reactive maintenance
- Technology lifecycle & refresh planning
- Long-term service level agreements
A decade of delivery — trusted by 275+ clients across industries
